Capabilities
This is a listing of our best capability.Note that these figures are not to be considered recommended values. Also keep in mind that some values can not be used at the same time for example min line and max thickness.
To make the design cost effective see page "Technology classes".
| PCB types |
· Single sided |
| Aspect ratio | 12:1 |
| Min. finished hole | 0,1mm |
| BLIND VIA- Min. hole | 0,05mm |
| BLIND VIA- Min. outerlayer pad | 0,2mm |
| BLIND VIA- Min. innerlayer pad | 0,2mm |
| BLIND VIA- Aspect ratio | 1:1 |
| BLIND VIA- Filled | Non conductive paste |
| Min. outerlayer pad | 0,05mm |
| Min. outerlager track | 0,035mm |
| Min. outerlager space | 0,035mm |
| Min. innerlayer pad | 0,2mm |
| Min. innerlayer track | 0,035mm |
| Min. innerlayer space | 0,035mm |
| Min. SMD-pad | 0,2mm |
| Min. component pitch | 0,37 |
| Max. boardthickness | 6,0mm |
| Min. boardthickness | 0,06mm |
| Max. copper thickness | 400µm |
| Min. copper thickness | 9µm |
| Min. distance layer to layer | 0,05mm |
| Innerlayer – layer to layer tolerance | +/-0,05mm |
| Min. isolation hole - innerlayer | 0,175mm |
| Max. boardsize | 520 x 720mm |
| Min. inside radius, routing | 0,25mm |
| Tolerance, routing | +/-0,05mm |
| Tolerance, V-cut | +/-0,05mm |
| Min boardthickness v V-cut | 0,5mm |
| Tolerance, hole size, plated | +/-0,05mm |
| Tolerance, hole position | +/-0,02mm |
| Tolerance board thickness | +/-10% |
| Peelable, min overlap | 0,2mm |
| Peelable, min clearence | 0,2mm |
| Clearence, soldermask | 0,03mm |
| Tolerance, controlled impedance | +/-10% - +/-5% |
| Soldermask, Photodefined | · Green · Red · White · Black · Blue |
| Surface treatments |
· HASL |
| Speciality prints | · Peelable, RoHS compatible · Carbon print |
| Materials | · FR4 - All existing. · Neltec · Rogers · Polyimide · RCC |
