HDI vias

Blind vias

Min. drilled hole = A = 0,1mm
Min. outerlayer pad  = B = 0,2mm
Min. innerlayer pad  = C = 0,2mm
Aspect ratio = D:A = 1:1
 

Combination of hidden and blind vias

If blind and hidden vias are present as a combination, please contact Multi-Teknik to get the current capability, since other properties of the Pcb can affect final suggestions.

 

Filled blind vias
If blind vias are located in SMD pads, we can on critical constructions provide filled blind vias to get a flat surface. This is often a help if the design requires to hit a BGA solderpad with a via.