HDI
HDI (High Dense Interconnect) are PWB`s designed when space is scarce like in mobile phones and computers. but also in more advanced industrial applications.The main difference being in thinner conductors and so called blind vias (not fully penetrating holes). MULTI-TEKNIK is able to deliver prototypes from 4 work days and volumes in 20-25 work days.
- FR-4, high-Tg, halogen free, epsilon stable, RCC-foil
- ENIG (Immersion Au), LF-HAL, HAL, Immersion-Sn,
Immersion-Ag,OSP
- Bond-Au, selective Au, connectors, buttons etc.
- Soldermask and legend most all colours
- Copper 18 - 500 µm
- Thickness 0,3 - 6,0 mm
- 4 - 40 layers
- Blind, burried, stacked vias and backdrilling.
- Resin -copperfilled blind vias, sequential buildup
- Impedance controlled and verified
- CAM, DFM, panel optimisation, product criticism
- QC (Quality control) by MULTI-TEKNIK with attached report
document
- IPC Class II and III
