CoC

Before we ship, at least one out of every 100 boards is meticulously controlled and rated for all important characteristics. This rating is done towards your specifications or alternatively PERFAG.

Below you will find an explanation to what is checked:

Hole diameter:
Using the drill drawing all hole diameters are checked for correct size and  whether plate/not plated.

Outline:
The outline and other mechanical properties are controlled.

Board thickness:
The board thickness is measured.

Hole-plating:
Using a Caviderm the thickness of the plating is measured in around 10 holes evenly divided over the board area. Plating thickness less than 20 my is not accepted. Mean value as well as Max and Min thickness is listed in the report.

Solder mask:
Control of the positioning and general appearance of the solder mask.

Positioning of Pattern:
Control of pad Positioning in relation to hole.

Legend:
Positioning, general appearance and readability of the print.

Special prints:
Positioning and general appearance

Gold:
General appearance

Line width:
Control of the thinnest line to be within specification.

Peel strength:
One board per week is checked according to IPC standard

Tape test:
The adhesion of solder mask, legend print, special prints and gold according to IPC standard.

Solder ability:
The board is soldered using a normal wave soldering machine and the severability is assessed.

Solder sample:
Always bipacked, with the exception of when there are no plated holes or no boards to be spared for a test that renders the board unusable.

Micro sectioning:
Out of every production day one board is micro sectioned to check  the general hole quality and the thickness of copper plating, solder mask, gold plating and carbon print. We also check  the thickness, width and general appearance of the conductors. all this is done to control  the general performance of the production.

ROHS TEST:
All batches are analyzed for lead content.

Twist and warp:
Controlled to be within limits.

Base material:
Controlled.