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CAM preparation in the late 80's. 14-inch screen and a 286 PC with breathtaking 1.64 Megabytes of RAM. Diskettes to transfer files.
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The DOS based CRM tool "SÖK", written in Pascal by Patrik Johansson in the late 80s.
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Production order with barcodes for updating each production section for CRM (SÖK).
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Installation of our first photo plotter in the mid 80's. The plotter was at one time Europe's largest with 28 fixed apertures.
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Laser plotter "Gerber Crecent 30" of drum type. Early 90s.
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Three-spindle CNC drilling machine, Trudril 93. Magazine for eight hole sizes. Paper tape for loading drill programs. Late 70s.
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Pluritec "Multistation". Single-spindle, CNC drilling machine with air-bearings and with 800 tools and automatic loading and unloading. 1997.
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Pluritec "Multistation". Internal image of the same machine. The blue on the right is the magazine for the drill tools.
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First HDI PCB 1999. Blind via, made with mechanical drill tool of 0.15mm.
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X-ray drilling machine. Pluritec Inspecta. Early 2000s. After pressing multilayer the machine adjusts the drill program. Deviations were fed to the CAM system for compensation of future in-house production.
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X-ray drilling machine. Pluritec Inspecta inside.
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Alignment of inner layers.
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Manual line for galvanic plating of copper for fully plated double-sided printed circuit boards. Mid 70s.
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Automatic line for galvanic plating of copper for fully plated printed circuit boards. Installed in the mid 80's and was in operation throughout our production.
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Lantroninc Blackhole. A successful replacement for the somewhat fragile process of chemical apply of copper in the holes. This method involved applying a thin layer of carbon in the hole wall to prepare for the galvanic process. 1996.
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Brown oxide (also called "black oxide") as surface treatment of inner layers before pressing multilayer to increase adhesion. 1996.
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Quicksilver "hotair" for tinning of printed ciruit boards. 1982.
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BASF Nylotron exposure machine for exposure of the layout pattern on photoresist. Early 80s.
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Clean room for the photographic part of pattern generation. Note the yellow protective light. Mid 80s.
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Development of layout patterns.
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Olec Accutray. Exposure machine with automatic layout alignment. 2001
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Screen printing of layout, soldermask and legend printing. On the left, its layout printing and to the right, its legend printing. Early 80s.
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Dry film soldermask, 1986. Vacuum laminator DuPont Vaccrel. The solder mask was a "film on a roll" type, which was laminated to the pattern with heat and vacuum. As solder mask, it had outstanding performance, but with its thickness of 76um, it is today passed to the history books.
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Modern type, curtain coating line. Ciba Geigy Probimer 150c, 1993. The printed circuit boards was shot trough a curtain of liquid solder mask and was then developed and cured.
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Close up of curtain. Ciba Geigy Probimer 150c.
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Mania MPP 3828 electrical test, 1984. Electrical test for needle bed. Test fixtures of plexi glass were drilled for each part number and was archived for future orders. The test was a "comparative test".
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Electronia Viking DV12DB Gävle, 1994. Electrical test with translator board that managed the complete test of boards that were double-sided surface mounted.
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"Flying probe" eltest "Mania Speedy". The machine imported gerber data and tested the boards with two probes per side. Early 2000s.
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AOI (Automatic Optical Inspection) "CamTek AOI system 2v30". Primarily, a optical inspection of inner layers before pressing. 1999
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Lab department in our new premises on Banehagsgatan in Gothenburg. 2009
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Exterior with the bridge "Älvsborgsbron" in the background.